With the development of microelectromechanical system (MEMS) technology, the limitations of machining technology
for silicon-based materials become more and more distinct. With its abilities on sub-micron structure machining, the
pulsed laser micro-fabrication technology has an extensive application prospect in MEMS and many other materials. The
thermal interaction process of polymer under laser irradiation is very complex, regularities on polymer target under laser
irradiation between displacement and laser energy density can only be obtained through experiments. Based on finite
element method (FEM), simulations have been performed and compared with experiment results. Relations among
pulsed laser intensity, actuation duration and thermal shock loads were obtained from the comparison, and a formula for
calculating the maximum ablation pressure of a carbon fiber epoxy resin polymer composites was proposed. This study
provides theoretical basis to the pulsed laser micro-fabrication technology's application in the fields of MEMS.
The silicon-based materials are widely used in MEMS. In this article, the thermal shock property of silicon-based
materials under the multi-pulsed laser irradiation is studied and theoretical deduction under a relative numerical case is
performed. Based on the non-Fourier conduction and the thermo-elastic theories, theoretical expressions between
temperature and thermal stress of a silicon-based material under the multi-pulse heat flow are deduced; regularities
among inner surplus temperature, time and depth in a silicon-based target and corresponding boundary are studied;
further more, curves of inner thermal stress in cases of different relation time are obtained by using the finite difference
method. As results indicated, under the multi-pulsed laser irradiation, the temperature curves present a delayed character
in different section away from the boundary, which are closely connected with the relaxation time. In the non-Fourier
theoretical solution, the front of the stress wave is very steep and presents an obvious thermal shock property. The
conclusion may be helpful to the micro-fabrication technology in the fields of MEMS.
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