Dr. Xiaoning Li
Product Engineer at Focuslight Technologies Inc
SPIE Involvement:
Author
Publications (10)

PROCEEDINGS ARTICLE | February 20, 2017
Proc. SPIE. 10123, Novel In-Plane Semiconductor Lasers XVI
KEYWORDS: Packaging, Gold, High power lasers, Copper, Indium, Reliability, Laser applications, Laser development, Corrosion, Semiconductor lasers, High power diode lasers, Pulsed laser operation, Thermal efficiency, Laser bonding

PROCEEDINGS ARTICLE | April 22, 2016
Proc. SPIE. 9730, Components and Packaging for Laser Systems II
KEYWORDS: Gold, High power lasers, Indium, Reliability, Laser development, Resistance, Numerical simulations, Semiconductor lasers, High power diode lasers

PROCEEDINGS ARTICLE | April 22, 2016
Proc. SPIE. 9730, Components and Packaging for Laser Systems II
KEYWORDS: Packaging, High power lasers, Copper, Reliability, Semiconductor lasers, Near field, High power diode lasers, Laser bonding, Laser systems engineering

PROCEEDINGS ARTICLE | February 20, 2015
Proc. SPIE. 9346, Components and Packaging for Laser Systems
KEYWORDS: Packaging, Continuous wave operation, Polarization, Copper, Indium, Reliability, Fiber lasers, Semiconductor lasers, High power diode lasers, Heatsinks

PROCEEDINGS ARTICLE | February 20, 2015
Proc. SPIE. 9346, Components and Packaging for Laser Systems
KEYWORDS: Packaging, Indium, Reliability, Laser applications, Laser welding, Semiconductor lasers, High power diode lasers, Heatsinks, Laser bonding, Liquids

PROCEEDINGS ARTICLE | February 20, 2015
Proc. SPIE. 9346, Components and Packaging for Laser Systems
KEYWORDS: Packaging, Copper, Interfaces, Reliability, Laser development, Numerical simulations, Semiconductor lasers, Thermal effects, Finite element methods, High power diode lasers

Showing 5 of 10 publications
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