Process window OPC (PWOPC) is widely used in advanced technology nodes as one of the most important resolution enhancement techniques (RET).1 PWOPC needs to consider not only edge placement error (EPE) from nominal condition simulations, but also constraints based on process variation simulations, such as pinch and bridge related requirements based on process variation band (PVBAND). Those constraints can be challenging to meet as feature size continues to shrink in advanced nodes.
In this paper a novel matrix retargeting based PWOPC was developed to find optimal OPC solutions by solving constraints-based matrix and applying minimal retargeting as needed.2 Experiment results showed enhanced process window and reasonable performance.
In this paper advanced OPC (Optical Proximity Correction) methods, additional with assistant features, and non-obvious
methods were implemented to correct aberrations caused by aggressive illuminations in order to optimize the shape of
the finger tips. OPC model and simulations were verified using 2D verification method.
A perspective is presented on how the semiconductor integrated circuit industry has evolved and what we can expect over the next decade or two. However, this 'forecast' is given in only the broadest sense, to make it relatively independent on innovations and discoveries that are likely to strongly shape the industry over this time period. Rather, trends are examined, as well as general 'tools' that will undoubtedly be important in advancing from our present microelectronics era to our presumable future in nanoelectronics.