Laser processing has demonstrated great capabilities for processing the flat panel display glass, strengthened glass, and flexible glass for consumer electronics. In this paper, a variety of laser processing techniques and their applications are discussed. The techniques include glass cutting, drilling, and surface modification. To assess each technique, a matrix of criteria, such as speed, surface quality, strength, and process stability is proposed. Based on the matrix, future needs for laser processing of glass are outlined.
Chemically strengthened glass is finding increasing use in handheld, IT and TV cover glass applications. Chemically
strengthened glass, particularly with high (>600MPa) compressive stress (CS) and deeper depth of layer (DOL), enable
to retain higher strength after damage than non-strengthened glass when its surface is abraded. Corning Gorilla® Glass
has particularly proven to be advantageous over competition in this attribute. However, due to high compressive stress
(CS) and Central Tension (CT) cutting ion-exchanged glass is extremely difficult and often unmanageable where ever
the applications require dicing the chemically strengthened mother glass into smaller parts. We at Corning have
developed a CO<sub>2</sub> laser scribe and break method (LSB) to separate a single chemically strengthened glass sheet into
plurality of devices. Furthermore, CO<sub>2</sub> laser scribe and break method enables debris-free separation of glass with high
edge strength due to its mirror-like edge finish. We have investigated laser scribe and break of chemically strengthened
glass with surface compressive stress greater than 600 MPa. In this paper we present the results of CO<sub>2</sub> scribe and break
method and underlying laser scribing mechanisms. We demonstrated cross-scribe repetitively on GEN 2 size chemically
strengthened glass substrates. Specimens for edge strength measurements of different thickness and CS/DOL glass were
prepared using the laser scribe and break technique. The specimens were tested using the standard 4-point bend method
and the results are presented.
In this paper we present the result of a sensitive experimental technique used to provide information about the limitations of using organic polymers for fiber-optic high power applications. Optical path adhesives are commonly used in fiber optics assemblies due to their mechanical and optical properties. However, their use in high power applications creates certain concerns about short-term and long-term stability of the adhesive material. We developed an approach for evaluating the effects of high power in optical path adhesives used in applications for fiber-optic devices. We extended far field experimental technique for analysis on a thin polymer layer placed on the tip of an optical fiber exposed to a wide range of optical powers. We found that this technique can be used for both thermo-optical effects evaluation and electronic non-linear contributions to the refractive index of the material. We show how this method permits separation of these two effects, and long term behavior of polymer materials in such applications. This approach could be used for evaluation of wide range polymer materials in photonics.
A method capable of measuring the internal transmittance <i>T</i><sub>i </sub>of fused silica @193 nm with a precision better than 0.01 %/cm (3σ) is presented. The basic idea is to vary the optical pathlength during the measurement within one and the same prism-shaped sample by moving the latter through the optical test beam. In comparison to the standard multiple-sample experiment this greatly relaxes the requirements for the repeatability of surface preparation. Lack of any standards makes it currently impossible to determine the absolute accuracy experimentally. However, calculations indicate that it is very likely within 0.02 %/cm (3σ). The application to materials and wavelengths other than what were chosen here for demonstration is straightforward.