Dr. Xuhan Dai Profile

Dr. Xuhan Dai

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Proceedings Article | 8 September 2011 Paper

Optical communication components based on non-silicon MEMS technology

Xu-han Dai, Yi Huang, Gui-fu Ding, Xiaolin Zhao

Proceedings Volume 8191, 819107 (2011) https://doi.org/10.1117/12.901207

KEYWORDS: Silicon, Nickel, Microelectromechanical systems, Micromachining, Optical communications, Optical fibers, Electroplating, Copper, Camera shutters, Semiconducting wafers

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This paper presents non-silicon MEMS technology for fabrication of Optical communication components. Both pure non-silicon and combined micromachining technologies were realized. For the pure non-silicon surface micromachining technology, the Ni and permalloy were chosen as the structure layer; the photo resist and copper were chosen as the sacrificial layer. Based on the technology, the micro-hinge was realized. It may find ample application in the out-of-plane microstructure, which is common in free-space optical transmission. As an example, a MEMS variable optical attenuator is introduced. It consisted of a hinged shutter to adjust the optical power transmission between the input and output optical fibers. For the combined micromachining fabrication, the electroplating was combined with the traditional bulk silicon technology to realize some unique structure for passive alignment. For example, we had developed the micro-fabricated nickel clamps for packaging of optical fibers in photonics devices. Compared with the all silicon scheme, this approach only involves one additional sputtering, photolithography, and electroplating process.. The presented non-silicon micromachining process offered more choice of material and facilitated the implementation of structure innovation.

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