Micro-Rings have been widely used for measurement of residual tensile stress in thin films. This measurement approach provides a simple and convenient way to estimate the stress. However, it still lacks accuracy compared to other methods. In this study, we propose an alternative design, which arranges the central beam in the vertical orientation, shrinks the beam width, and widens the ring width to limit the undesired out-of-plane deformation of the ring portion and thus to improve the measurement results. The simulation result both has verified our design. The ring portion of conventional micro-ring is easily deformed in the out-of-plane direction when subjected to residual stress. In our design, such undesired out-of-plane buckling can be effectively prevented. Some suggestions for limiting the undesired out-of-plane deformation have been proposed. Following these suggestions, the more precise critical buckling length and the more accurate stress measurement will be obtained.