Yeonho Pae
at KLA-Tencor Corp
SPIE Involvement:
Author
Publications (3)

PROCEEDINGS ARTICLE | March 20, 2010
Proc. SPIE. 7636, Extreme Ultraviolet (EUV) Lithography
KEYWORDS: Signal to noise ratio, Defect detection, Inspection, Scanning electron microscopy, Wafer inspection, Photomasks, Line width roughness, Extreme ultraviolet lithography, Line edge roughness, Semiconducting wafers

PROCEEDINGS ARTICLE | March 24, 2009
Proc. SPIE. 7272, Metrology, Inspection, and Process Control for Microlithography XXIII
KEYWORDS: Lithography, Modulation, Inspection, Scanning electron microscopy, Process control, Finite element methods, Wafer inspection, Panoramic photography, Semiconducting wafers, Defect inspection

PROCEEDINGS ARTICLE | March 24, 2009
Proc. SPIE. 7272, Metrology, Inspection, and Process Control for Microlithography XXIII
KEYWORDS: Semiconductors, Reticles, Electronics, Contamination, Inspection, Signal processing, Wafer inspection, Semiconducting wafers, Yield improvement, Defect inspection

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