Dr. Yi-Sha Ku
Senior Principal Researcher at Industrial Technology Research Institute
SPIE Involvement:
Senior status | Conference Program Committee | Author
Area of Expertise:
optical metrology , overlay , modeling and algorithm , advanced lithography , measurement standard , 3D interconnect
Profile Summary

Interests: Metrology technologies, modeling, algorithm and applications for advanced lithography and manufacturing.

Inventor of in-chip overlay metrology, which has been adopted worldwide and are regarded as essential for the most advanced semiconductor processes. Evaluated optimal printing parameters and established appropriate methodologies, demonstrated the effectiveness on 45/55/65 nm node production wafer at TSMC.

Lead metrology-process integration in ITRI-TSMC-Nanometrics joint develop project of in-chip overlay metrology. Developed 2D/3D image formation model to optimize the overlay target design for specific process layers. Developed image asymmetric algorithm to determine overlay with nanometer sensitivity.

Developed optical metrology for advanced manufacturing industry at ITRI. Collaborated on overlay metrology with TSMC/IBM/AMD/Nanometrics, established effective performance metrics.

Managed broadband spectral reflectometry research and applications for determining high aspect ratio TSV (Through Silicon Vias) depth and bottom shape. Enabled 3D interconnect metrology market penetration and new system sales.




Publications (36)

SPIE Journal Paper | 24 February 2018
JM3 Vol. 17 Issue 01
KEYWORDS: Diffraction, Diffraction gratings, Extreme ultraviolet, Sensors, Charge-coupled devices, CCD cameras, Laser scattering, CCD image sensors, Scatterometry, Scanning electron microscopy

Proceedings Article | 20 August 2015
Proc. SPIE. 9556, Nanoengineering: Fabrication, Properties, Optics, and Devices XII
KEYWORDS: Extreme ultraviolet, Diffraction gratings, Diffraction, Metrology, Databases, Light sources, 3D metrology, Algorithms, Mirrors, CCD cameras

Proceedings Article | 22 June 2015
Proc. SPIE. 9525, Optical Measurement Systems for Industrial Inspection IX
KEYWORDS: Semiconducting wafers, Reflection, Wafer-level optics, Mirrors, Sapphire, Fringe analysis, Error analysis, LCDs, Calibration, Image sensors

SPIE Journal Paper | 25 March 2014
JM3 Vol. 13 Issue 01
KEYWORDS: Metrology, Inspection, 3D metrology, Process control, Integrated circuits, 3D modeling, Manufacturing, Roads, Standards development, Control systems

SPIE Journal Paper | 6 March 2014
JM3 Vol. 13 Issue 01
KEYWORDS: Reflectivity, Reflectometry, Semiconducting wafers, 3D metrology, Metrology, Oxides, Scanning electron microscopy, Silicon, Etching, Calibration

Showing 5 of 36 publications
Conference Committee Involvement (11)
Metrology, Inspection, and Process Control for Microlithography XXXIV
24 February 2020 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXIII
25 February 2019 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXII
26 February 2018 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXI
27 February 2017 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXX
22 February 2016 | San Jose, California, United States
Showing 5 of 11 Conference Committees
SIGN IN TO:
  • View contact details

UPDATE YOUR PROFILE
Is this your profile? Update it now.
Don’t have a profile and want one?

Advertisement
Advertisement
Back to Top