Dr. Ying Cai
at Univ of Texas at Arlington
SPIE Involvement:
Conference Program Committee | Author
Publications (6)

Proceedings Article | 4 January 2008
Proc. SPIE. 6836, MEMS/MOEMS Technologies and Applications III
KEYWORDS: Microelectromechanical systems, Waveguides, Polymers, Glasses, Dielectrics, Silicon, Capacitance, Telecommunications, Bridges, Phase shifts

Proceedings Article | 8 January 2007
Proc. SPIE. 6414, Smart Structures, Devices, and Systems III
KEYWORDS: Microelectromechanical systems, Actuators, Gold, Electrodes, Dielectrics, Scanning electron microscopy, Finite element methods, Mechanical engineering, Electrical breakdown, Temperature metrology

Proceedings Article | 20 December 2006
Proc. SPIE. 6415, Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems III
KEYWORDS: Microelectromechanical systems, Polymers, Metals, Dielectrics, Silicon, Photoresist materials, Capacitance, Telecommunications, Bridges, Phase shifts

Proceedings Article | 5 January 2006
Proc. SPIE. 6035, Microelectronics: Design, Technology, and Packaging II
KEYWORDS: Microelectromechanical systems, Beam steering, Switches, Finite-difference time-domain method, Switching, Waveguides, Electrodes, Metals, Telecommunications, Antennas

Proceedings Article | 5 January 2006
Proc. SPIE. 6035, Microelectronics: Design, Technology, and Packaging II
KEYWORDS: Fabrication, Microelectromechanical systems, Waveguides, Signal attenuation, Etching, Polymers, Glasses, Dielectrics, Silicon, Finite element methods

Proceedings Article | 5 January 2006
Proc. SPIE. 6035, Microelectronics: Design, Technology, and Packaging II
KEYWORDS: Fabrication, Gold, Resonators, Waveguides, Silicon, Linear filtering, Iris, Electroplating, Tolerancing, Eye models

Showing 5 of 6 publications
Conference Committee Involvement (1)
Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems IV
10 December 2008 | Melbourne, Australia
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