Ying Luo
Field Applications Engineer at Tokyo Electron America Inc
SPIE Involvement:
Author
Publications (3)

PROCEEDINGS ARTICLE | March 24, 2009
Proc. SPIE. 7272, Metrology, Inspection, and Process Control for Microlithography XXIII
KEYWORDS: Wafer-level optics, Metrology, Etching, Silicon, Reflectometry, Process control, Finite element methods, Critical dimension metrology, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | December 1, 2008
Proc. SPIE. 7140, Lithography Asia 2008
KEYWORDS: Mathematical modeling, Thin films, Metrology, Data modeling, Optical properties, Scatterometry, Process control, Integrated optics, Critical dimension metrology, Semiconducting wafers

PROCEEDINGS ARTICLE | March 25, 2008
Proc. SPIE. 6922, Metrology, Inspection, and Process Control for Microlithography XXII
KEYWORDS: Metrology, Etching, Metals, Copper, Transmission electron microscopy, Reflectometry, Photomasks, Critical dimension metrology, Chemical mechanical planarization, Back end of line

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