Design technology co-optimization (DTCO) study on self-aligned-via (SAV) with Lamella DSA for sub-7 nm technology
Model-based guiding pattern synthesis for on-target and robust assembly of via and contact layers using DSA
Directed self-assembly compliant flow with immersion lithography: from material to design and patterning
Directed Self Assembly (DSA) compliant flow with immersion lithography: from material to design and patterning
Directed self assembly on resist-limited guiding patterns for hole grapho-epitaxy: Can DSA help lower EUV's source power requirements?
Compact model experimental validation for grapho-epitaxy hole processes and its impact in mask making tolerances
Challenges and opportunities in applying grapho-epitaxy DSA lithography to metal cut and contact/via applications
Calibration and application of a DSA Compact model for graphoepitaxy hole processes using contour-based metrology