In this paper, the influence of the conditions of chemical and electrochemical nickel plating of nanostructured silicon and subsequent heat treatment on the phase composition of Si/Ni structures with advanced interface is studied. Nanostructured silicon formed by chemical and electrochemical etching was used for the formation of a developed interphase surface. The resulting Si/Ni samples were analyzed using scanning electron microscopy, energy dispersive X-ray analysis, and X-ray phase analysis. The experiments have revealed the differences in phase composition of the Si/Ni structures obtained by different methods, both before and after heat treatment.
The investigation of promising materials used as lead-free solders has been conducted for a long time. In this connection, special attention is paid to low-melting-point metals and alloys, however the search for optimal systems is still going on. The systems Ag-Sn due to excellent electronic conductivity are the most attractive ones. The aim of this work is the development of modes of the electrochemical formation of Ag-Sn layers of the required composition on the surface of the copper plate, and also the investigation of the Ag-Sn structure composition influence on thermodynamic properties in the range of temperatures from the room temperature to 500 °С. During the investigation there has been developed a set of recommendations on the choice of appropriate electrolytes for deposition of Sn and Ag, optimal current density for obtaining a high-quality coating. On the basis of the differential scanning calorimetry data, it has been established that the Ag-Sn systems of a certain composition have the optimal characteristics. The obtained results allow us to develop the formation methods of solders with given thermodynamic characteristics and to set the temperature ranges of stability for application as metallization systems. Begin the abstract two lines below author names and addresses. The abstract summarizes key findings in the paper.