Yung-Feng Cheng
Manager at United Microelectronics Corp
SPIE Involvement:
Author
Publications (21)

PROCEEDINGS ARTICLE | March 31, 2014
Proc. SPIE. 9052, Optical Microlithography XXVII
KEYWORDS: Scattering, Metals, Error analysis, Printing, Photoresist materials, Bridges, Photomasks, Double patterning technology, Optical proximity correction, Semiconducting wafers

PROCEEDINGS ARTICLE | September 9, 2013
Proc. SPIE. 8880, Photomask Technology 2013
KEYWORDS: Lithography, Diffusion, Image registration, Photomasks, Line width roughness, Double patterning technology, Manganese, Critical dimension metrology, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | April 12, 2013
Proc. SPIE. 8683, Optical Microlithography XXVI
KEYWORDS: Wafer-level optics, Lithography, Metrology, Printing, Photomasks, Source mask optimization, Optical proximity correction, Critical dimension metrology, Semiconducting wafers, Tolerancing

PROCEEDINGS ARTICLE | April 12, 2013
Proc. SPIE. 8683, Optical Microlithography XXVI
KEYWORDS: Wafer-level optics, Lithography, Logic, Radon, Manufacturing, Process control, Photomasks, Extreme ultraviolet lithography, Source mask optimization, Resolution enhancement technologies

PROCEEDINGS ARTICLE | June 30, 2012
Proc. SPIE. 8441, Photomask and Next-Generation Lithography Mask Technology XIX
KEYWORDS: Wafer-level optics, 3D modeling, Scanning electron microscopy, Printing, Photomasks, Extreme ultraviolet, Line width roughness, Critical dimension metrology, Line edge roughness, Semiconducting wafers

PROCEEDINGS ARTICLE | March 13, 2012
Proc. SPIE. 8326, Optical Microlithography XXV
KEYWORDS: Lithography, Diffractive optical elements, Computer simulations, 3D modeling, Printing, Photomasks, SRAF, Critical dimension metrology, Semiconducting wafers, Tolerancing

Showing 5 of 21 publications
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