Ultrasound tomography is to reconstruct tissue mechanical properties using ultrasound signals for cancer characterization. We study the capability of plane-wave ultrasound-waveform inversion to reconstruct sound-speed values of prostate tumors. Our ultrasound-waveform inversion algorithm iteratively fits synthetic ultrasound waveforms with recorded ultrasound waveforms starting from an initial model. We verify the algorithm using synthetic ultrasound data for numerical prostate phantoms consisting of multiple tumors in homogeneous and heterogeneous background prostate tissues. Our reconstruction results demonstrate that our new plane-wave transrectal ultrasound-waveform tomography has the potential to accurately reconstruct the sound-speed values of prostate tumors for cancer characterization. In addition, we build a new transrectal ultrasound tomography prototype using a 256-channel Verasonics Vantage system and a GE intracavitary curved linear array to acquire plane-wave ultrasound reflection data for transrectal ultrasound tomography.
The development of a truly smart camera, with inherent capability for low latency semi-autonomous object recognition, tracking, and optimal image capture, has remained an elusive goal notwithstanding tremendous advances in the processing power afforded by VLSI technologies. These features are essential for a number of emerging multimedia- based applications, including enhanced augmented reality systems. Recent advances in understanding of the mechanisms of biological vision systems, together with similar advances in hybrid electronic/photonic packaging technology, offer the possibility of artificial biologically-inspired vision systems with significantly different, yet complementary, strengths and weaknesses. We describe herein several system implementation architectures based on spatial and temporal integration techniques within a multilayered structure, as well as the corresponding hardware implementation of these architectures based on the hybrid vertical integration of multiple silicon VLSI vision chips by means of dense 3D photonic interconnections.