Mr. Zhenli Zhao Profile

Zhenli Zhao

at Shanghai Institute of Technical Physics CAS

SPIE Involvement:

Author

Publications (2)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 24 November 2021 Paper

Focused micro-lens array design and performance testing

Hongyan Xu, Defeng Mo, Yingjie Ma, Zhenli Zhao, Xiangyang Liu, Tong Zhao, Xue Li

Proceedings Volume 12061, 1206111 (2021) https://doi.org/10.1117/12.2605952

KEYWORDS: Staring arrays, Microlens array, Light sources, CCD cameras, Microscopes, Zemax, Spherical lenses, Sensors, Optical fibers, Optical alignment

Read Abstract +

In order to improve the detection sensitivity of single-photon detection infrared imaging camera image sensor, the study is based on the structure of InGaAs infrared focal plane detector array. By using ZEMAX software, the size and position changes of the imaging light spot of the micro-lens array in the case of incident at different field of view angles are compared and analyzed, and the structural parameters are optimized. A 64×64 Si refracted micro-lens array is designed and manufactured. The study established a microoptical measuring system for micro-lens arrays, including light source, optical fiber, collimation, imaging and measuring devices. The measuring method and process of the parameters are introduced briefly. The morphology, geometric structure parameters and focal length of the micro-lens can be measured, therefore, the micro-lens can be evaluated effectively. The results show that the micro-lens array has good surface profile, good geometric uniformity and good optical properties.

Proceedings Article | 24 October 2017 Paper

Progress in ultrasonic bonding wire process and quality evaluation of bonding point

Zhenli Zhao, Defeng Mo, Jiarong Wu, Mengdie Jiang, Jinglin Zhang, Lin Xu

Proceedings Volume 10462, 104624X (2017) https://doi.org/10.1117/12.2285650

KEYWORDS: Ultrasonics

Read Abstract +

Wire bonding is one of the most widely used methods in the field of electrical connecting in packaging. The main characteristics of common wire bonding materials and process parameters affecting the reliability of wire bonding are discussed and analyzed. The evaluation method of wire bonding quality is described, and the measures to enhance the reliability of wire bonding are put forward. The results show that of all the wire materials, gold wire (Au) has the best comprehensive performance which used most widely. Aluminum wire (Al) and copper wire (Cu) are ideal materials for the replacement of Au because of low cost. Platinum wire (Pt) is mainly used in low temperature packaging for its low heat loss. In terms of bonding process parameters, bonding force is an important parameter for the shape and strength of bonding point. Adjusting the bonding force is an effective method to solve the problem of pad damage and bonding interface slip. Ultrasonic power and time are the important factors affecting bonding strength. Usually it is easier to bond wires with higher bonding temperature, and appropriate temperature is exist due to the device’s tolerance temperature. In the wire bonding quality evaluation methods, microscopic observation is the simplest method to evaluate the bonding quality. The mechanical testing methods include wire pull test and ball shear test. Environmental tests include temperature cycling, electromagnetic resonance test and other testing. It is mainly used to evaluate the overall performance and fatigue properties of wire bonding. As a result, the mechanical testing and environmental testing are the effective methods to adjust the new bonding process , and microscopic inspection is an effective method for bonding quality assurance.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years