Mr. Mike Xiang Profile

Mike Xiang

Development Engineer at JSR Micro

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Author

Publications (7)

Proceedings Article | 15 April 2008 Paper

High-etch-rate low-bias bow outgassing BARC via-filling materials for 193-nm ArF lithographic process

Huirong Yao, Zhong Xiang, Salem Mullen, Jian Yin, Walter Liu, Jianhui Shan, Elleazar Gonzalez, Guanyang Lin, Mark Neisser

Proceedings Volume 6923, 69232J (2008) https://doi.org/10.1117/12.773400

KEYWORDS: Etching, Lithography, Polymers, Reflectivity, Semiconducting wafers, Coating, Immersion lithography, Chromophores, Scanning electron microscopy, Bottom antireflective coatings

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Proceedings Article | 6 April 2007 Paper

Organic ArF bottom anti-reflective coatings for immersion lithography

Zhong Xiang, Hong Zhuang, Hengpeng Wu, Jianhui Shan, Dave Abdallah, Jian Yin, Salem Mullen, Huirong Yao, Eleazar Gonzalez, Mark Neisser

Proceedings Volume 6519, 651929 (2007) https://doi.org/10.1117/12.710669

KEYWORDS: Etching, Reflectivity, Immersion lithography, Photomasks, Chemical vapor deposition, Lithography, Bottom antireflective coatings, Semiconducting wafers, Control systems, Signal attenuation

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Proceedings Article | 29 March 2006 Paper

The effects of etch chemistry on the etch rates of ArF BARC products

Hong Zhuang, Dave Abdallah, Zhong Xiang, Hengpeng Wu, Jianhui Shan, Ping-Hung Lu, Mark Neisser, Eugene Karwacki, Bing Ji, Peter Badowski

Proceedings Volume 6153, 61530N (2006) https://doi.org/10.1117/12.657128

KEYWORDS: Etching, Reactive ion etching, Chemistry, Polymers, Anisotropic etching, Ions, Semiconducting wafers, Photoresist materials, Oxygen, Gases

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Proceedings Article | 14 May 2004 Paper

Design and development of high etch rate organic bottom antireflective coating for sub-100 nm node and beyond

Hengpeng Wu, Zhong Xiang, Aritaka Hishida, David Abdallah, Jianhui Shan, Eleazar Gonzalez, Shuji Ding, Mark Neisser

Proceedings Volume 5376, (2004) https://doi.org/10.1117/12.537883

KEYWORDS: Etching, Polymers, Photoresist materials, Lithography, Fourier transforms, Semiconducting wafers, Bottom antireflective coatings, Optical lithography, Scanning electron microscopy, Refractive index

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Proceedings Article | 24 July 2002 Paper

Characterization and improvement of resist pattern collapse on ArF (193 nm) organic B.A.R.C.

Young-Sun Hwang, Jae Chang Jung, Kyu-Dong Park, Sung-Koo Lee, Jin-Soo Kim, Keun-Kyu Kong, Ki-Soo Shin, Shuji Ding, Zhong Xiang, Mark Neisser

Proceedings Volume 4690, (2002) https://doi.org/10.1117/12.474189

KEYWORDS: Polymers, 193nm lithography, Lithography, Photoresist processing, Refractive index, Line edge roughness, Semiconductors, Chromophores, Scanning electron microscopy, Reflectivity

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Proceedings Article | 24 July 2002 Paper

Optimization of organic bottom antireflective coatings' compatibility with ArF resists

Zhong Xiang, Jianhui Shan, Eleazar Gonzalez, Hengpeng Wu, Shuji Ding, Mark Neisser, Bang-Chein Ho, Harrison Chen

Proceedings Volume 4690, (2002) https://doi.org/10.1117/12.474186

KEYWORDS: Etching, Reflectivity, Fourier transforms, Polymers, Bottom antireflective coatings, 193nm lithography, Lithography, Coating, Silicon carbide, Neodymium

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Proceedings Article | 24 July 2002 Paper

Development of 193-nm B.A.R.C.s for dual damascene applications

Hengpeng Wu, Zhong Xiang, Eleazar Gonzalez, Jianhui Shan, Shuji Ding, Wen-Bing Kang, Aritaka Hishida

Proceedings Volume 4690, (2002) https://doi.org/10.1117/12.474188

KEYWORDS: Semiconducting wafers, Polymers, Etching, Copper, Photoresist materials, Optical lithography, Fourier transforms, Aluminum, Dielectrics, Glasses

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Showing 5 of 7 publications

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