Mr. Cees Lambregts Profile

Cees Lambregts

at ASML

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Author

Publications (6)

Proceedings Article | 28 April 2023 Presentation + Paper

Overview of stitching for high NA: imaging and overlay experimental and simulation results

Natalia Davydova, Lieve van Look, Vincent Wiaux, Joost Bekaert, Frank Timmermans, Eelco van Setten, Bram Slachter, Laura Huddleston, Claire van Lare, Rongkuo Zhao, Dezheng Sun, Ming-Chun Tien, Marcel Beckers, Simon van Gorp, Cees Lambregts, Chung-Tien Li, Arthur van de Nes, Koen D'Havé, Tatiana Kovalevich, Diederik de Bruin, Stephen Hsu, Rene Carpaij

Proceedings Volume 12494, 124940Q (2023) https://doi.org/10.1117/12.2658511

KEYWORDS: Photomasks, Optical proximity correction, Reflection, Critical dimension metrology, Tantalum, Reflectivity, Metrology, Semiconducting wafers, Scanners, Reticles

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Proceedings Article | 23 March 2020 Presentation + Paper

Holistic alignment approach for on-product overlay improvement on DUV lithography process with combined solutions

Jigang Ma, Miao Yu, Cees Lambregts, Sotirios Tsiachris, Paul Böcker, Jun-Yeob Kim, Won-Kwang Ma, Sang-Jun Han, Chan-Ha Park, Kyong-Seok Kim, Jung-Hwan Kim, Sang-Jun Park, Gwang-Gon Kim

Proceedings Volume 11327, 113270S (2020) https://doi.org/10.1117/12.2552938

KEYWORDS: Optical alignment, Overlay metrology, Semiconducting wafers, Deep ultraviolet, Scanners, Lithography, Sensors, Optimization (mathematics), Feedback control

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Proceedings Article | 20 March 2020 Paper

Improving after-etch overlay performance using high-density in-device metrology in DRAM manufacturing

Ik-Hyun Jeong, Seung-Woo Koo, Hyun-Sok Kim, Jung-Il Hwang, Dong-Jin Lee, Min-Shik Kim, Jae-Wuk Ju, Kang-Min Lee, Young-Sik Kim, Cees Lambregts, Rizvi Rahman, Marc Hauptmann, Raheleh Pishkari, Allwyn Boustheen, Kwang-Young Hu, Paul Böcker, Dong-Hak Lee, In-Ho Joo, Kang-San Lee

Proceedings Volume 11325, 113252X (2020) https://doi.org/10.1117/12.2552028

KEYWORDS: Overlay metrology, Etching, Inspection, Semiconducting wafers, Metrology, Feedback loops, Scanners, Spatial frequencies, High volume manufacturing

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Proceedings Article | 20 March 2019 Presentation + Paper

Improved wafer alignment model algorithm for better on-product overlay

Ik-Hyun Jeong, Hyun-Sok Kim, Yeong-Oh Kong, Ji-Hyun Song, Jae-Wuk Ju, Young-Sik Kim, Cees Lambregts, Miao Yu, Rizvi Rahman, Leendertjan Karssemeijer, Elliott McNamara, Paul Böcker, Jong-Cheol Choi, Nang-Lyeom Oh, Kang-San Lee, Jin-Seo Lee

Proceedings Volume 10961, 109610A (2019) https://doi.org/10.1117/12.2516259

KEYWORDS: Optical alignment, Semiconducting wafers, Calibration, Data modeling, Overlay metrology, Metrology, Scanners, High volume manufacturing, Lithography, Sensors

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Proceedings Article | 13 March 2018 Presentation + Paper

Computational metrology: enabling full-lot high-density fingerprint information without adding wafer metrology budget, and driving improved monitoring and process control

Hyun-Sok Kim, Min-Sung Hyun, Jae-Wuk Ju, Young-Sik Kim, Cees Lambregts, Peter van Rhee, Johan Kim, Elliott McNamara, Wim Tel, Paul Böcker, Nang-Lyeom Oh, Jun-Hyung Lee

Proceedings Volume 10585, 105851P (2018) https://doi.org/10.1117/12.2297182

KEYWORDS: Computational modeling, Metrology, Overlay metrology, Semiconducting wafers, Process control, Sensors, Optical alignment, Computing systems, Inspection, Manufacturing

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Proceedings Article | 28 March 2017 Presentation + Paper

Computational overlay metrology with adaptive data analytics

Emil Schmitt-Weaver, Venky Subramony, Zakir Ullah, Masazumi Matsunobu, Ravin Somasundaram, Joel Thomas, Linmiao Zhang, Klaus Thul, Kaustuve Bhattacharyya, Ronald Goossens, Cees Lambregts, Wim Tel, Chris de Ruiter

Proceedings Volume 10145, 101450V (2017) https://doi.org/10.1117/12.2258039

KEYWORDS: Semiconducting wafers, Metrology, Lithography, Overlay metrology, Analytics, Process control, Optical lithography, Semiconductors, Optical alignment, Contamination, Sensors, Neural networks, Data modeling

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Showing 5 of 6 publications

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