A method of photomask substrate fabrication is demonstrated ,that the surface figure and roughness of fused silica will converge to target precision rapidly with the full aperture polishing. Surface figure of optical flats in full aperture polishing processes is primarily dependent on the surface profile of polishing pad, therefor, a improved function of polishing mechanism was put forward based on two axis lapping machine and technology experience, and the pad testing based on displacement sensor and the active conditioning method of the pad is applied in this research. Moreover , the clamping deformation of the thin glass is solved by the new pitch dispensing method. The experimental results show that the surface figure of the 152mm×152mm×6.35mm optical glass is 0.25λ(λ=633nm) and the roughness is 0.32nm ,which has meet the requirements of mask substrate for 90~45nm nodes.
Continuous polishing technology is an important means to realize batch processing of large aperture and high precision planar optical components. However, traditional continuous polishing process largely depends on the operator's experience, with poor controllability of component surface figure and unstable processing efficiency. In order to solve this problem, the in-situ shape measurement technologies including measurement of pitch lap surface figure and workpiece surface figure have been proposed in this paper. The real-time states of the pitch lap flatness and the workpiece surface figure in polishing process are obtained by in-situ measurement technologies, which provide the quantitative informations for adjusting process parameters. In the experiment, a large aperture mirror (material as K9; size as 800mm×400mm×100mm) was polished. The results show that the surface figure of the component was improved from λ/2 (1λ=632.8nm) to λ/6 by using the in-situ measurement technologies during the continous polishing process.