Subsurface damage (SSD) of fused silica elements formed by grinding and polishing will produce high-energy laser modulation and absorption effects. Further induced macro damage will seriously decrease the precision of the optical system and shorten the service life of the optical element. Because of the limit of the optical manufacturing technology, cost, and other reasons, it is hard to grinding and polishing without generating SSD. Thus, efficiently suppress the depth of SSD becomes an important research direction to further enhance the accuracy of the optical system. We use the equations for median and lateral cracks depths to predict the depth of SSD and surface roughness (P-V value). The equations are derived by Lambropoulos from micro indentation mechanics and hill model for indentation of a sharp indenter. The lateral cracks theory and the measurement data on the high-precision roughness measuring instrument are used to solving and verify the grinding empirical formula. This can effectively solve the problems of detecting indentation normal load during process. The empirical formula is then combined with the equations for median and lateral cracks depths to establish an optimization model. With this model, we design an optimization algorithm to optimize the parameters of process to suppress the depth of SSD. Gradient algorithm is used to optimize the parameters of the whole process, and design a high efficiency fused silica process solution to obtain a minimal depth of SSD and high-precision surface. The above algorithm has certain universality for different processing machines, materials, and processing conditions. Change the material parameters and constraints can quickly obtain the corresponding processing parameters.
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