For the volume mask production of 28nm node and beyond, the defect disposition is an important factor for mask
process, due to the scaling feature sizes and advanced resolution enhancement technologies. In this paper, the series of
specifications for different mask patterns have been established from the defect printability study through the behaviors
of programmed defects with varies types and sizes on mask, AIMS and wafer. The defect disposition to qualify the mask
defects and verify the defect repair proceeds on the basis of the defect printability study. It is found that the defect
specification is an effective and industrialized approach for mask production.