Development of multi-mode, high-power, large-aperture two-dimensional VCSEL arrays, operating at a nominal wavelength of 940nm, with highly stable beam profile will be presented. They are designed and fabricated using Trilumina’s proprietary flip-chip-bondable back-side-emitting VCSEL array chip technology. We have demonstrated that a 150-element VCSEL chip array with the improved design shows divergence angle (FWHM) of less than 15°. Additionally, we have integrated this design into drive circuitry that allows us to achieve peak optical powers in excess of 400W.
scalable optical power outputs and the capability to separately address sub-array regions while maintaining fast turn-on and turn-off response times. Performance of these devices is critically dependent both on the design of the VCSEL devices and the design of the sub-mount, which provides both the electrical and thermal contacts for the array. Recent results for modelling and optimization of the VCSELs and their corresponding sub-mounts are discussed.
Flip-chip bonding enables a unique architecture for two-dimensional arrays of VCSELs. Such arrays feature scalable power outputs and the capability to separately address sub-array regions while maintaining fast turn-on and turn-off response times. These substrate-emitting VCSEL arrays can also make use of integrated micro-lenses for beam shaping and directional control. Advances in the performance of these laser arrays will be reviewed and emerging applications are discussed.
A unique architecture for two-dimensional arrays of VCSELs that allow for simultaneous high-power output and highbandwidth modulation has been developed for a variety of applications. The arrays use integrated micro-lenses for beam shaping and control, and to enable incoherent beam combining to make compact, high-brightness sources with low coherence noise. The fabrication and performance of the laser arrays are reviewed and sample applications are discussed.