Yifan Zhang
at Cadence Design Systems Inc
SPIE Involvement:
Author
Publications (11)

PROCEEDINGS ARTICLE | March 30, 2017
Proc. SPIE. 10148, Design-Process-Technology Co-optimization for Manufacturability XI
KEYWORDS: Roads, Statistical analysis, Databases, Manufacturing, Inspection, Control systems, Semiconductor manufacturing, Optical proximity correction, Structural design, Manufacturing equipment, Semiconducting wafers, Failure analysis, Product engineering, Plutonium, New and emerging technologies, Data analysis, Design for manufacturability

PROCEEDINGS ARTICLE | March 30, 2017
Proc. SPIE. 10148, Design-Process-Technology Co-optimization for Manufacturability XI
KEYWORDS: Defect detection, Manufacturing, Diagnostics, Optical proximity correction, Structural design, Diagnostic tests, Semiconducting wafers, Failure analysis, Product engineering, Electrical breakdown

PROCEEDINGS ARTICLE | March 30, 2017
Proc. SPIE. 10148, Design-Process-Technology Co-optimization for Manufacturability XI
KEYWORDS: Defect detection, Silicon, Diagnostics, Data processing, Diagnostic tests, Semiconducting wafers, Signal detection, Failure analysis, Product engineering, Yield improvement, Electrical breakdown, Process engineering

PROCEEDINGS ARTICLE | March 30, 2017
Proc. SPIE. 10148, Design-Process-Technology Co-optimization for Manufacturability XI
KEYWORDS: Roads, Manufacturing, Data processing, Profiling, Photoacoustic tomography, Semiconductor manufacturing, Molybdenum, Excel, Plutonium, Information operations

PROCEEDINGS ARTICLE | March 30, 2017
Proc. SPIE. 10148, Design-Process-Technology Co-optimization for Manufacturability XI
KEYWORDS: Multilayers, Statistical analysis, Data modeling, Manufacturing, Inspection, Profiling, Measurement devices, Structural design, Failure analysis, Electrical breakdown, Data analysis

PROCEEDINGS ARTICLE | March 28, 2017
Proc. SPIE. 10148, Design-Process-Technology Co-optimization for Manufacturability XI
KEYWORDS: Databases, Silicon, Manufacturing, Inspection, Data processing, Image classification, Optical proximity correction, Structural design, Semiconducting wafers, Defect inspection

Showing 5 of 11 publications
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