Yonghyeon Kim
at SAMSUNG Electronics Co Ltd
SPIE Involvement:
Author
Publications (6)

PROCEEDINGS ARTICLE | March 16, 2016
Proc. SPIE. 9781, Design-Process-Technology Co-optimization for Manufacturability X
KEYWORDS: Inspection, Quantitative analysis, Defect detection, Image processing, Solids, Design for manufacturing, Design for manufacturability, Manufacturing, Semiconducting wafers, Error analysis, Critical dimension metrology, Double patterning technology, Metrology

PROCEEDINGS ARTICLE | March 19, 2015
Proc. SPIE. 9424, Metrology, Inspection, and Process Control for Microlithography XXIX
KEYWORDS: Semiconducting wafers, Inspection, Composites, Scanning electron microscopy, Reticles, Double patterning technology, Sensors, Optical lithography, Etching, Line edge roughness

PROCEEDINGS ARTICLE | March 18, 2015
Proc. SPIE. 9427, Design-Process-Technology Co-optimization for Manufacturability IX
KEYWORDS: Bridges, Overlay metrology, Inspection, Composites, Metrology, Error analysis, Semiconducting wafers, Optical lithography, Lithography, Defect inspection

PROCEEDINGS ARTICLE | March 15, 2012
Proc. SPIE. 8327, Design for Manufacturability through Design-Process Integration VI
KEYWORDS: Transistors, Optical proximity correction, Critical dimension metrology, Lithography, Semiconducting wafers, Design for manufacturing, Etching, Image classification, Photomasks, Manufacturing

PROCEEDINGS ARTICLE | April 5, 2011
Proc. SPIE. 7974, Design for Manufacturability through Design-Process Integration V
KEYWORDS: Critical dimension metrology, Inspection, Semiconducting wafers, Manufacturing, Transistors, Etching, Lithography, Control systems, Design for manufacturability, Photomasks

PROCEEDINGS ARTICLE | June 28, 2005
Proc. SPIE. 5853, Photomask and Next-Generation Lithography Mask Technology XII
KEYWORDS: Inspection, Photomasks, Image processing, Etching, Defect detection, Signal processing, Particles, Signal detection, Manufacturing, Contamination

Showing 5 of 6 publications
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