Proceedings Article | 15 October 2012
Proc. SPIE. 8419, 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices for Sensing, Imaging, and Solar Energy
KEYWORDS: Light emitting diodes, Resistance, Convection, Copper, Cooling systems, Liquids, 3D modeling, Thermal modeling, Finite element methods, Electrons
Considering the characteristic of energy-saving about high power LED device, a method to decrease the junction
temperature greatly under the natural convection condition is studied in this article. Using the heat pipe technology, a cooling system is designed in which the target heat source is the LED module (0.025m×0.025m×0.005m), with 30W input power. The mechanism and routes of heat transfer are analyzed in detail, the thermal network model is established to calculate the thermal resistance of each part in the cooling system, the total thermal resistance was calculated to be 0.8964°C /W and the junction temperature was 47.39°C . Meanwhile, the finite element method was used to simulate this cooling system, and got that the junction temperature was 47.54°C , and the error of the two means is only 0.15°C , it indicates that applying heat-pipe technology can solve the problem of high junction temperature in LED devices under the natural convection conditions, which can guide the actual project in the thermal design.
