The smile effect is caused by the thermal stress in the packaging process. If packaging technology of a diode laser array
is poor, smile effect will be very bad and the smile effect will vary with storage time. To accurately measure smile effect
and to objectively compare the different measuring methods for smile effect, a set of optical system is designed for
measuring the smile effect. By using an image amplification method, the smile effect of a diode laser array is accurately
measured, and the measurement error is about ±0.1μm. By researching, the heat sink surface flatness has little influence
on smile effect. However the solder quality is a critical factor for smile effect. That is to say, there is more voids, the
corresponding smile effect is more serious in this area. Reflow soldering curve has a major impact on smile effect in the
packaging process of a diode laser array .During reflow soldering process, accelerated cooling before solidification and
slow cooling after solidification not only can commendably reduce voids and smile effect ,but also can effectively solve
the smile effect with storage time variation problem .By optimizing the reflow soldering curve of a diode laser array , the
smile effect has been controlled within ±0.5μm..As the smile effect values of a semiconductor laser array is diminished
and the beam quality of a laser diode array is improved significantly. The recommended method provides favorable
conditions for the beam collimation and shaping of a semiconductor laser array.
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