Paper
16 August 2002 Feasibility study of manufacturing process and quality control for the new alternating PSM structure
Yasutaka Morikawa, Haruo Kokubo, Masaharu Nishiguchi, Masami Nara, Yousuke Totsu, Morihisa Hoga, Naoya Hayashi
Author Affiliations +
Proceedings Volume 4764, 18th European Conference on Mask Technology for Integrated Circuits and Microcomponents; (2002) https://doi.org/10.1117/12.479337
Event: 18th European Mask Conference on Mask Technology for Integrated Circuits and Micro-Components, 2002, Munich-Unterhaching, Germany
Abstract
Alternating phase-shifting mask (Alt.PSM) technology is the most effective approach to expand resolution limitation and expand the process window of lithography. Currently, etched quartz Alt.PSMs have been introduced not only for device development but also for production use. We have been supplying Alt.PSMs with Single trench + Undercut structures for the mass-production of KrF lithography and reported this structure is applicable for ArF lithography. (*1,2,3) On the other hand, we have introduced preliminary manufacturing results of the new Alt.PSM structure. (*3) This structure has the advantages, which are exempted from biasing issues and narrow chrome width limitations. (*4) In order to make sure the adaptability of this new Alt.PSM structure in mass-manufacturing, we started to investigate productivity for this structure. In this report, we will discuss about the feasibility study of manufacturing process and quality control which include CD performance results, alignment error tolerance evaluations and defect assurance evaluations.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yasutaka Morikawa, Haruo Kokubo, Masaharu Nishiguchi, Masami Nara, Yousuke Totsu, Morihisa Hoga, and Naoya Hayashi "Feasibility study of manufacturing process and quality control for the new alternating PSM structure", Proc. SPIE 4764, 18th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (16 August 2002); https://doi.org/10.1117/12.479337
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KEYWORDS
Quartz

Inspection

Process control

Optical alignment

Etching

Cadmium

Binary data

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