Paper
22 April 2024 Flexible, biocompatible photoresists for fabricating electronic, in vivo, and microfluidic devices
Foad Vashahi, Andrew Spencer, Hyunsu Park, Harris Miller, Tianyang Ye, Paul Le Floch
Author Affiliations +
Abstract
Development of advanced electronic and microfluidic devices requires innovative photoresist solutions to fabricate these increasingly complex devices. Novel requirements on the properties of traditional photoresists may include mechanical flexibility, stretchability, dielectric stability, low water permeability, and small molecule absorption. Here, we introduce a novel series of perfluoropolyether photoresists (SNER: Soft Negative Elastomeric Resist) that are compatible with i-line photolithography techniques. Depending on the chemical formulation, the elastic modulus of the cured resist can be controlled in the range of 1 to 100MPa. The film thickness range is 0.1 to 200μm, with a 2 to 5μm resolution, and good adhesion to sputtered metal. Soft biocompatible microelectrode arrays realized with SNER showed year-long dielectric stability in physiological solutions, comparable to that of SU-8 2000, and significantly lower ionic permeability than polydimethylsiloxane (PDMS).
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Foad Vashahi, Andrew Spencer, Hyunsu Park, Harris Miller, Tianyang Ye, and Paul Le Floch "Flexible, biocompatible photoresists for fabricating electronic, in vivo, and microfluidic devices", Proc. SPIE PC12956, Novel Patterning Technologies 2024, PC129560X (22 April 2024); https://doi.org/10.1117/12.3010475
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KEYWORDS
Photoresist materials

Microfluidics

Dielectrics

Polydimethylsiloxane

Polymers

Permeability

Microfabrication

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