Paper
19 November 1980 Laser Scanner For Automatic Inspection Of Printed Wiring Boards
Philip Geise, Eugene George, Fritz Freese, Robert Brown, Victor Ruwe
Author Affiliations +
Proceedings Volume 0255, Practical Electro-Optical Instruments and Techniques; (1980) https://doi.org/10.1117/12.959558
Event: 1980 Huntsville Technical Symposium, 1980, Huntsville, United States
Abstract
An, Instrument is described which inspects unpopulated, populated (components onserted and leads clinched), and soldered printed wiring boards for correct hole location, component presence, correct lead clinch direction and solder bridges. The instrument consists of a low power heliumneon laser, an x-y moving iron galvanometer scanner and several folding mirros. A unique shadow signature is detected by silicon photodiodes located at the optium geometry to allow rapid and reliable detection of components with correctly clinched leads. A reflective glint screen is utilized to inspect for a solder bridges. The detected signal are processed and evaluated by a minocomputer which also controls the scan inspection rate of at least 25 components or 50 components holes per second. The return of investment on this instrument for high volume production of printed wirind boards is less than one yea and only slightly longer for medium run military application.
© (1980) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Philip Geise, Eugene George, Fritz Freese, Robert Brown, and Victor Ruwe "Laser Scanner For Automatic Inspection Of Printed Wiring Boards", Proc. SPIE 0255, Practical Electro-Optical Instruments and Techniques, (19 November 1980); https://doi.org/10.1117/12.959558
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KEYWORDS
Inspection

Lead

Scanners

Laser scanners

Bridges

Mirrors

3D scanning

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