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The entire electronic materials market is continually pushed node over node. In the past, the progression of exposure wavelengths that enabled advancement against Moore’s law gave rise to new resist chemistries that would then undergo years of refinement and optimization to squeeze the maximum resolution and CD control from each platform. The push on materials for resolution and process latitude continues today, but these are becoming secondary to new focus areas such as the material contributions to edge placement error (LWR, CDU), planarization, gap filling, and etch selectivity. At the same time, these new materials must be introduced with lower and lower defect contributions. Originally, many materials suppliers focused mainly on supporting their customers with photoresist solutions within the electronic materials space. Today suppliers continue to develop new photoresists but have expanded into complementary segments such as organic underlayers, spin-on metal anti-reflective coatings, topcoats, a variety of shrinking and slimming approaches as well as CMP pads and slurries. Semiconductor integration of new materials from across the periodic table leads us to develop new wet-cleaning chemistries and even materials that self-assemble in bottoms up patterning. In parallel segments such as 2.5D and 3D packaging bring on new challenges in the space of advancing thick resists for plating applications and permanent spin on dielectrics. Additionally, advances in display technology needs, along with CMOS image sensors bring even further challenges to the materials suppliers. As our view within electronic materials expands, we have a unique perspective into how materials are influencing and shaping the electronic industry. This talk will present an overview with the long term vision of our future digital society including how electronics industry evolves and how materials fit into the larger picture.
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