Presentation + Paper
4 March 2022 Pulsed laser deposition systems and lasers for pilot and volume production
Author Affiliations +
Abstract
Pulsed laser deposition has evolved into a production technology for growing thin film materials with properties which are challenging to obtain by classical deposition methods such as sputtering or sol-gel deposition. Novel wafer based PLD system technology based on powerful excimer lasers allows universities, institutes and foundries to add 30+ new materials and material systems to their deposition portfolio enabling fabrication e.g. of electro-optical materials, transparent conductive oxides and perovskites. Dielectric, ferroelectric and piezoelectric material depositions can also be performed in any desirable sequence and can run with a single wafer load-lock, cassette handler or integrated with pre-clean station as part of the Solmates cluster platform. Deposition results obtained with the latest 300 mm wafer platform will be discussed.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ralph Delmdahl, Oliver Haupt, Bart Berenbak, Lennart de Vreede, and Arjen Janssens "Pulsed laser deposition systems and lasers for pilot and volume production", Proc. SPIE 11989, Laser-based Micro- and Nanoprocessing XVI, 119890K (4 March 2022); https://doi.org/10.1117/12.2606173
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KEYWORDS
Semiconducting wafers

Pulsed laser deposition

Thin films

Excimer lasers

Laser stabilization

Thin film deposition

Aluminum nitride

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