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Flip-chip VCSELs with backside emission and lenses directly etched into the GaAs substrate are the most compact way to integrate optics with the VCSEL (ViBO = VCSEL with integrated Backside Optics). Beam shapes with lens structures enabling collimation as well as the uniform illumination of a defined field of view have been realized. Superior to separate optical elements the integrated optics avoids the need for individual alignment of laser die and optics and makes them an irremovable part of the chip. The realization of both contacts on the epitaxy side enables flip-chip assembly without the need for wire bonds, thus enabling ultra-short pulse operation. VCSELs are preferred for LiDAR applications due to their thermal stability and reliability. The required high brilliance can be achieved by micro-optics. Scaling the power into the kilowatt range requires stacked junctions and multi-chip concepts. This paper presents a new LiDAR system concept exploiting the potential of VCSELs with integrated optics.
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Holger Moench, Stephan Gronenborn, Xi Gu, Markus Herper, Roman Koerner, Johanna Kolb, Armand Pruijmboom, Stefan Schlegel, Alexander Weigl, "ViBO: VCSEL with integrated backside optics for LiDAR applications," Proc. SPIE 12439, Vertical-Cavity Surface-Emitting Lasers XXVII, 1243909 (15 March 2023); https://doi.org/10.1117/12.2647569