Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patterns

Jaime Bravo; Philippe Morey-Chaisemartin; Lifu Chang; Eric Beisser; Frederic Brault; Joshua Zusman

doi:10.1117/12.2657011

28 April 2023 Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patterns

Jaime Bravo, Philippe Morey-Chaisemartin, Lifu Chang, Eric Beisser, Frederic Brault, Joshua Zusman

Author Affiliations +

Proceedings Volume 12495, DTCO and Computational Patterning II; 1249511 (2023) https://doi.org/10.1117/12.2657011
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

The demand for high-performance semiconductor products has increased with no end in sight since the early days of this industry. This product demand phenomenon has continuously pushed the technological frontier to a moving limit for enhanced performance leading to the need for an ever-thinner die for advanced 3D packaging. Die down to a thickness of 5 µm is feasible. The thin die approach may lead to a heterogenous stack of 50 dies, leading to the highest available performance with an unprecedented form factor. One significant barrier is the fragility of the thin die and its impact on yield, reliability, and costs. A comprehensive crack propagation and thin die fragility model that is rich in both theory and application is presented. In this paper, we show an MPW reticle placement with automation that inserts new and specific crack-stop patterns to mitigate the risk of die wafer fracture. We show this method to address die fracture from both the front and the back sides of the wafer, yielding an authentic 3D approach to crack-stop.

Conference Presentation

Citation Download Citation

Jaime Bravo, Philippe Morey-Chaisemartin, Lifu Chang, Eric Beisser, Frederic Brault, and Joshua Zusman "Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patterns", Proc. SPIE 12495, DTCO and Computational Patterning II, 1249511 (28 April 2023); https://doi.org/10.1117/12.2657011

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available