A CMOS compatible silicon modulator of 3D-optimized interleaved design with high modulation efficiency

Zijian Zhu; Yingxuan Zhao

doi:10.1117/12.2656266

27 December 2022 A CMOS compatible silicon modulator of 3D-optimized interleaved design with high modulation efficiency

Zijian Zhu, Yingxuan Zhao

Proceedings Volume 12504, International Symposium on Silicon-based Optoelectronics (ISSBO 2022); 1250404 (2022) https://doi.org/10.1117/12.2656266
Event: International Symposium on Silicon-based Optoelectronics (ISSBO 2022), 2022, Hangzou, China

Abstract

Interleaved modulators enable more optimized doping profiles for higher modulation efficiency and lower loss. Nevertheless, as far as we know, complex doping for interleaved modulators has hardly been studied. Hence this work proposes a modulator based on interleaved vertical and U-shaped junctions using the Monte-Carlo simulation. The results illustrate that the modulation efficiency of the designed interleaved period is 0.57 V·cm, while the loss is 15.5 dB/cm. This high-efficiency design verifies the benefits of interleaved 3D modulator design as significantly increasing modulation efficiency with low loss, showing great potential for high-speed application.

Citation Download Citation

Zijian Zhu and Yingxuan Zhao "A CMOS compatible silicon modulator of 3D-optimized interleaved design with high modulation efficiency", Proc. SPIE 12504, International Symposium on Silicon-based Optoelectronics (ISSBO 2022), 1250404 (27 December 2022); https://doi.org/10.1117/12.2656266

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