High-brightness OLED-on-silicon on semitransparent CMOS backplane for advanced near-to-eye microdisplays

Philipp Wartenberg; Bernd Richter; Stephan Brenner; Johannes Zeltner; Christian Schmidt; Judith Baumgarten; Andreas Fritscher; Simone Lenk; Martin Rolle; Michael Törker; Uwe Vogel

doi:10.1117/12.2675479

7 August 2023 High-brightness OLED-on-silicon on semitransparent CMOS backplane for advanced near-to-eye microdisplays

Philipp Wartenberg, Bernd Richter, Stephan Brenner, Johannes Zeltner, Christian Schmidt, Judith Baumgarten, Andreas Fritscher, Simone Lenk, Martin Rolle, Michael Törker, Uwe Vogel

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Proceedings Volume 12624, Digital Optical Technologies 2023; 1262416 (2023) https://doi.org/10.1117/12.2675479
Event: SPIE Digital Optical Technologies, 2023, Munich, Germany

Abstract

Emissive OLED-on-silicon microdisplays have been considered being opaque only so far. However, modern and advanced silicon CMOS process nodes are increasingly made on silicon-on-insulator (SOI) substrates. By separating the SOI handle wafer from the buried oxide (BOX) layer (that has the active silicon on top) and applying space-cautious layout design of the CMOS active devices as well as wiring layers it is possible to achieve semitransparent, high-resolution CMOS backplanes for microdisplays. Similar to regular OLED-on-silicon the emissive frontplane becomes embedded by waferlevel OLED post-processing. Yet, depending on pixel density and array layout a microdisplay transparency of <20% can be achieved now. Consequently, the semi-transparent microdisplay becomes the optical combiner itself, eliminating the exit pupil expander (EPE), which drastically improves the optical efficiency from the light source into the eye box. Additionally, new high-brightness OLED achieving <35kcd/m² in monochrome, or 10kcd/m² in color versions, and their integration onto the OLED-on-SOI platform and an ultra-low power pixel cell backplane architecture (power consumption <10mW) pave the way for matching both form factor and battery life requirements in optical see-through NTE, enabling new optical concepts for augmented-reality (AR) devices.

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Philipp Wartenberg, Bernd Richter, Stephan Brenner, Johannes Zeltner, Christian Schmidt, Judith Baumgarten, Andreas Fritscher, Simone Lenk, Martin Rolle, Michael Törker, and Uwe Vogel "High-brightness OLED-on-silicon on semitransparent CMOS backplane for advanced near-to-eye microdisplays", Proc. SPIE 12624, Digital Optical Technologies 2023, 1262416 (7 August 2023); https://doi.org/10.1117/12.2675479

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KEYWORDS

Transparency

Semiconducting wafers

Organic light emitting diodes

Design and modelling

Wafer-level optics

Silicon

Emissivity

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