Analysis of surface temperature uniformity of temperature controlled wafer chuck based on fluid simulation

Junyu Zhangzhou; Caiying He; Xiaobo Zhang

doi:10.1117/12.2685078

19 October 2023 Analysis of surface temperature uniformity of temperature controlled wafer chuck based on fluid simulation

Junyu Zhangzhou, Caiying He, Xiaobo Zhang

Author Affiliations +

Proceedings Volume 12709, Fourth International Conference on Artificial Intelligence and Electromechanical Automation (AIEA 2023); 1270957 (2023) https://doi.org/10.1117/12.2685078
Event: Fourth International Conference on Artificial Intelligence and Electromechanical Automation (AIEA 2023), 2023, Nanjing, China

Abstract

In order to study the temperature characteristics of temperature-controlled wafer chuck and make its temperature uniformity meet the use requirements. In this paper, a structure of temperature-controlled wafer chuck is proposed firstly. On this basis, the fluid dynamics simulation model of the external flow field of temperature-controlled wafer chuck is built by using the Flow simulation software. By solving the model, the surface temperature map of the Vacuum chuck under the steady temperature of 125℃ is obtained. Secondly, the rationality of the model is proved by building a prototype for experiments, collecting the temperature data of each point on the surface of the Vacuum chuck and comparing the simulation data. Finally, based on the simulation model, the response surface experiment is designed and the maximum temperature difference regression equation is obtained, which provides great reference value for engineering designers.

Citation Download Citation

Junyu Zhangzhou, Caiying He, and Xiaobo Zhang "Analysis of surface temperature uniformity of temperature controlled wafer chuck based on fluid simulation", Proc. SPIE 12709, Fourth International Conference on Artificial Intelligence and Electromechanical Automation (AIEA 2023), 1270957 (19 October 2023); https://doi.org/10.1117/12.2685078

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