Numerical simulation of optimizing plating uniformity of gold plating

Jing Xiang; Hongzhi Zhang; Yongqiang Su; Zeng Chong; Chong Wang; Yaning Lin; Liangliang Tian; Guohui Hu

doi:10.1117/12.2679534

18 July 2023 Numerical simulation of optimizing plating uniformity of gold plating

Jing Xiang, Hongzhi Zhang, Yongqiang Su, Zeng Chong, Chong Wang, Yaning Lin, Liangliang Tian, Guohui Hu

Proceedings Volume 12722, Third International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2023); 127220Q (2023) https://doi.org/10.1117/12.2679534
Event: International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2023), 2023, Hangzhou, China

Abstract

The uniformity of gold plating of 6-inch wafers in conventional sulfate plating solution was studied by numerical simulation technology. The effects of current density, cathode and anode distance and baffle distance on plating uniformity were studied to obtain the gold plating layer with the uniformity of less than 5%. The results show that when the distance between the cathode and the anode is set to be 15.5 cm, and the distance between the baffle and the cathode is 4.5 cm, when the current density is 5-15A/m², the uniformity of electroplating gold is less than 5%, which meets the production requirements.

Citation Download Citation

Jing Xiang, Hongzhi Zhang, Yongqiang Su, Zeng Chong, Chong Wang, Yaning Lin, Liangliang Tian, and Guohui Hu "Numerical simulation of optimizing plating uniformity of gold plating", Proc. SPIE 12722, Third International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2023), 127220Q (18 July 2023); https://doi.org/10.1117/12.2679534

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