Presentation + Paper
12 March 2024 Laser singulation of high refractive index glasses for augmented reality waveguides
Author Affiliations +
Abstract
As Augmented Reality (AR) and Mixed Reality (MR) devices emerge and promise to revolutionize the way in which we perceive and interact with the world, the continued focus on the low-cost, high-volume manufacturing of the waveguides that underpin the technology is required. A significant challenge is the singulation of the high refractive index glass wafers into individual waveguides without affecting the sensitive optical components (e.g., gratings) on them. The laser nanoPerforation glass singulation process developed by Corning is well-established in multiple industrial applications and has been successfully deployed into high-volume manufacturing for AR waveguide devices. A detailed investigation into optimizing the edge strength of 0.5 mm thick Corning high refractive index glasses (n=1.7-2.0) reveals values in the range of 130-150 MPa (B10). By applying fundamental process understanding and further optimization to Corning 0.3 mm Augmented Reality Systems (ARS) 2.0 glass, an initial demonstration of edge strength values up to 202 MPa (B10) is realized.
Conference Presentation
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Jason R. Grenier and Erin Hosmer "Laser singulation of high refractive index glasses for augmented reality waveguides", Proc. SPIE 12872, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX, 1287203 (12 March 2024); https://doi.org/10.1117/12.3007998
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KEYWORDS
Glasses

Refractive index

Augmented reality

Waveguides

Laser cutting

Laser processing

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