Design, simulation model, and measurements for high-density interconnections

Udy A. Shrivastava

doi:10.1117/12.25515

1 April 1991 Design, simulation model, and measurements for high-density interconnections

Udy A. Shrivastava

Proceedings Volume 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies; (1991) https://doi.org/10.1117/12.25515
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

High density interconnections are essential for high performance systems. For excellent signal fidelity it is essential to design interconnects as controlled impedance transmission lines in these systems. Results from design studies are summarized in this paper. Effects of substrate and conductor properties on the interconnect parameters are emphasized. Crosstalk noise is proportional to interconnection density. Crosstalk can be analyzed in SPICE using a set of isolated transmission line and congruence transformers synthesized with dependent sources A SPICE subcircuit for a pair of coupled interconnections is presented. Using this subcircuit crosstalk calculations are illustrated for systems based ECL and CMOS technologies. High density interconnects have considerable resistance. Results of a theoretical analysis of the time domain reflectometer (TDR) responses of a lossy interconnect are presented. These results can be used to determine the impedance and the effective resistance of the interconnections using a TDR. This technique is especially useful for digital systems using lossy transmission line approach.

Citation Download Citation

Udy A. Shrivastava "Design, simulation model, and measurements for high-density interconnections", Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); https://doi.org/10.1117/12.25515

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