Three-dimensional capacitance modeling of advanced multilayer interconnection technologies

Daniel C. Edelstein

doi:10.1117/12.25537

1 April 1991 Three-dimensional capacitance modeling of advanced multilayer interconnection technologies

Daniel C. Edelstein

Proceedings Volume 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies; (1991) https://doi.org/10.1117/12.25537
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

There is no online version at this time. The PDF is only available to people who have bought the paper or have a subscription.

Citation Download Citation

Daniel C. Edelstein "Three-dimensional capacitance modeling of advanced multilayer interconnection technologies", Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); https://doi.org/10.1117/12.25537

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available