Paper
5 August 1994 Large-tolerance and low-dispersion optical chip-to-chip interconnects using grating couplers
Ming Li, John C.H. Lin, Stephen J. Sheard
Author Affiliations +
Proceedings Volume 2321, Second International Conference on Optoelectronic Science and Engineering '94; (1994) https://doi.org/10.1117/12.182122
Event: Optoelectronic Science and Engineering '94: International Conference, 1994, Beijing, China
Abstract
In this paper, we investigate the possibility of vertically interconnecting waveguides on different substrates using grating couplers. The coupling between waveguides is achieved using a holographic projection scheme. The effects of alignment and fabrication tolerances, as well as the dispersion characteristics, of this structure are considered. Simulation results show that this type of interconnection is surprisingly insensitive to fabrication errors.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ming Li, John C.H. Lin, and Stephen J. Sheard "Large-tolerance and low-dispersion optical chip-to-chip interconnects using grating couplers", Proc. SPIE 2321, Second International Conference on Optoelectronic Science and Engineering '94, (5 August 1994); https://doi.org/10.1117/12.182122
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