Hybrid Microelectronic Laser Machining Requirements

Paul F. Parks Sr.

doi:10.1117/12.946395

30 September 1985 Hybrid Microelectronic Laser Machining Requirements

Paul F. Parks Sr.

Proceedings Volume 0527, Applications of High Power Lasers; (1985) https://doi.org/10.1117/12.946395
Event: 1985 Los Angeles Technical Symposium, 1985, Los Angeles, United States

Abstract

Industrial application of lasers in the micro electronic industry is an established fact. The most prolific is in resistor trimming and ceramic substrate machining. Though the application has been applied since the 1960's there are still unresolved problems in the economic use of lasers in this area.

Citation Download Citation

Paul F. Parks Sr. "Hybrid Microelectronic Laser Machining Requirements", Proc. SPIE 0527, Applications of High Power Lasers, (30 September 1985); https://doi.org/10.1117/12.946395

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