High density interconnections in PCBs - an overview of plating techniques

Janusz Borecki

doi:10.1117/12.675093

26 April 2006 High density interconnections in PCBs - an overview of plating techniques

Janusz Borecki

Proceedings Volume 6159, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments IV; 61591U (2006) https://doi.org/10.1117/12.675093
Event: Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments IV, 2005, Wilga, Poland

Abstract

Extremely quick progress in miniaturization and functionality of electronic components more and more influences design and manufacture of Printed Circuit Boards (PCBs). Especially it concerns miniaturization and increasing of interconnection densities. The quality and reliability of manufactured interconnects depends on metallization technique. The aim of the paper is to describe the different plating techniques of High Density Interconnections (HDI) in PCBs.

Citation Download Citation

Janusz Borecki "High density interconnections in PCBs - an overview of plating techniques", Proc. SPIE 6159, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments IV, 61591U (26 April 2006); https://doi.org/10.1117/12.675093

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