Die-To-Database Inspection - An Effective Method Of Detecting And Locating Defects On Reticles

Eileen Jozefov; Steve Follis; Wayne Ruch

doi:10.1117/12.963712

20 August 1986 Die-To-Database Inspection - An Effective Method Of Detecting And Locating Defects On Reticles

Eileen Jozefov, Steve Follis, Wayne Ruch

Proceedings Volume 0633, Optical Microlithography V; (1986) https://doi.org/10.1117/12.963712
Event: 1986 Microlithography Conferences, 1986, Santa Clara, United States

Abstract

As the drive towards increased production of VLSI type devices continues, integrated circuit fabrication has become increasingly dependent on stepper technology to meet the demands for denser geometries, smaller critical dimensions, and tighter registration tolerances. This technology is based on repetitively exposing the wafers in a field-by-field manner using a reticle which is either a single or multi-die IC pattern. This technology differs from that of the 1X projection aligner in which there is a one-to-one correspondence between the mask and the imaged wafer.

Citation Download Citation

Eileen Jozefov, Steve Follis, and Wayne Ruch "Die-To-Database Inspection - An Effective Method Of Detecting And Locating Defects On Reticles", Proc. SPIE 0633, Optical Microlithography V, (20 August 1986); https://doi.org/10.1117/12.963712

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