Deep trenches fabricated by laser-induced backside wet etching for guiding light

Tadatake Sato; Amit Pratap Singh; Ryozo Kurosaki; Aiko Narazaki; Yoshizo Kawaguchi; Hiroyuki Niino

doi:10.1117/12.808637

24 February 2009 Deep trenches fabricated by laser-induced backside wet etching for guiding light

Tadatake Sato, Amit Pratap Singh, Ryozo Kurosaki, Aiko Narazaki, Yoshizo Kawaguchi, Hiroyuki Niino

Proceedings Volume 7201, Laser Applications in Microelectronic and Optoelectronic Manufacturing VII; 72010C (2009) https://doi.org/10.1117/12.808637
Event: SPIE LASE: Lasers and Applications in Science and Engineering, 2009, San Jose, California, United States

Abstract

By laser-induced backside wet etching (LIBWE), we can fabricate microfluidic channels on silica glasses. These channels have smooth bottom surfaces that can be combined with various optical detection techniques. Antiresonant guided optical wave (ARGOW) is a concept for guiding light in the system composed of a low refractive index medium surrounded by a medium with higher refractive index. The ARGOW was examined by using the wide channels (length: 17 mm, width: 1 mm, depth: 45 μm) prepared by LIBWE, whose bottom surface showed root-mean-square (RMS) roughness less than 100 nm. The LIBWE can fabricate deep trenches with high aspect ratio (~57 (length: 1mm, width: 10 μm, depth: 566 μm)). By using such deep channels, ARGOW system within a plane parallel to the top surface of glass can be fabricated. In this work, surface roughness of the sidewall of deep trenches prepared with LIBWE was evaluated, and the possibility of utilization for guiding light is discussed.

Citation Download Citation

Tadatake Sato, Amit Pratap Singh, Ryozo Kurosaki, Aiko Narazaki, Yoshizo Kawaguchi, and Hiroyuki Niino "Deep trenches fabricated by laser-induced backside wet etching for guiding light", Proc. SPIE 7201, Laser Applications in Microelectronic and Optoelectronic Manufacturing VII, 72010C (24 February 2009); https://doi.org/10.1117/12.808637

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KEYWORDS

Glasses

Sensors

CCD image sensors

Reflection

Silica

Charge-coupled devices

Laser beam diagnostics

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