Packaging of opto-electronic devices for flexible applications

Erwin Bosman; Geert Van Steenberge; Jeroen Missine; Bram Van Hoe; Peter Van Daele

doi:10.1117/12.841553

16 February 2010 Packaging of opto-electronic devices for flexible applications

Erwin Bosman, Geert Van Steenberge, Jeroen Missine, Bram Van Hoe, Peter Van Daele

Proceedings Volume 7607, Optoelectronic Interconnects and Component Integration IX; 76070G (2010) https://doi.org/10.1117/12.841553
Event: SPIE OPTO, 2010, San Francisco, California, United States

Abstract

This paper presents the latest results on the development of a thin flexible package of commercially available optoelectronics with polymer multimode waveguides. The GaAs VCSELs and Photodiodes are thinned down to 20 μm thickness, resulting in packages which can be bended to a bending radius of 2 mm with high reliability. With these actives, also waveguides and out-of-plane coupling structures are embedded inside the foil. Flexible Polyimide micromirrors were fabricated, characterized and embedded inside the foil. An embedded VCSEL to Photodiode optical waveguide link was demonstrated at a speed of 1.2 Gbs with open eye diagram. Temperature (-40 to 125 degrees Celsius) and humidity (85 rh/85 °C for 1000 hours) reliability was tested with good results. The total thickness of the completed foil containing actives, waveguides and coupling elements is only 145 μm.

Citation Download Citation

Erwin Bosman, Geert Van Steenberge, Jeroen Missine, Bram Van Hoe, and Peter Van Daele "Packaging of opto-electronic devices for flexible applications", Proc. SPIE 7607, Optoelectronic Interconnects and Component Integration IX, 76070G (16 February 2010); https://doi.org/10.1117/12.841553

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