Low-power XGA thermal camera for ground applications

Stanley Kummer

doi:10.1117/12.851738

3 May 2010 Low-power XGA thermal camera for ground applications

Stanley Kummer

Proceedings Volume 7660, Infrared Technology and Applications XXXVI; 76600C (2010) https://doi.org/10.1117/12.851738
Event: SPIE Defense, Security, and Sensing, 2010, Orlando, Florida, United States

Abstract

The advent of uncooled infrared, XGA (1024×768) focal plane arrays (FPAs) enables new applications for ground vehicles and soldier equipment. A low-power digital imaging module, based on a 17μm-pitch FPA, has been developed and packaged in a rugged housing for demonstration in a distributed aperture system. Cameras and the embedded thermal imaging modules have been delivered during 2009 and the module will be commercially available in 2010. This new capability can extend the performance of existing uncooled ground-based systems. Some background is presented. The product is described and several applications are introduced.

Citation Download Citation

Stanley Kummer "Low-power XGA thermal camera for ground applications", Proc. SPIE 7660, Infrared Technology and Applications XXXVI, 76600C (3 May 2010); https://doi.org/10.1117/12.851738

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available