Study of the three-dimensional shape measurement for mask patterns using Multiple Detector CD-SEM

Isao Yonekura; Hidemitsu Hakii; Masashi Kawashita; Yasushi Nishiyama; Keishi Tanaka; Yasutaka Kikuchi; Tsutomu Murakawa; Soichi Shida; Masayuki Kuribara; Toshimichi Iwai; Jun Matsumoto; Takayuki Nakamura

doi:10.1117/12.879400

20 April 2011 Study of the three-dimensional shape measurement for mask patterns using Multiple Detector CD-SEM

Isao Yonekura, Hidemitsu Hakii, Masashi Kawashita, Yasushi Nishiyama, Keishi Tanaka, Yasutaka Kikuchi, Tsutomu Murakawa, Soichi Shida, Masayuki Kuribara, Toshimichi Iwai, Jun Matsumoto, Takayuki Nakamura

Author Affiliations +

Proceedings Volume 7971, Metrology, Inspection, and Process Control for Microlithography XXV; 797121 (2011) https://doi.org/10.1117/12.879400
Event: SPIE Advanced Lithography, 2011, San Jose, California, United States

Abstract

The Multiple Detector CD-SEM acquires the secondary electron from pattern surface at each detector. The 3D shape and height of mask patterns are generated by adding or subtracting signal profile of each detector. In signal profile of the differential image formed in difference between left and right detector signal, including concavo-convex information of mask patterns. Therefore, the 3D shape of mask patterns can be obtained by integrating differential signal profile. This time, we found that proportional relation between pattern height and shadow length on one side of pattern edge. In this paper, we will report experimental results of pattern height measurement. The accuracy of measurement and side wall angle dependency are studied. The proposal method is applied to OMOG masks.

Citation Download Citation

Isao Yonekura, Hidemitsu Hakii, Masashi Kawashita, Yasushi Nishiyama, Keishi Tanaka, Yasutaka Kikuchi, Tsutomu Murakawa, Soichi Shida, Masayuki Kuribara, Toshimichi Iwai, Jun Matsumoto, and Takayuki Nakamura "Study of the three-dimensional shape measurement for mask patterns using Multiple Detector CD-SEM", Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 797121 (20 April 2011); https://doi.org/10.1117/12.879400

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available