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5 March 2022 Fiber-to-silicon photonics interposer for high-density vertical coupling through laser structured mirror-waveguide circuits
Gligor Djogo, Amir Rahimnouri, Jianzhao Li, Stephen Ho, Peter R. Herman
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Proceedings Volume PC12007, Optical Interconnects XXII; PC120070H (2022) https://doi.org/10.1117/12.2609088
Event: SPIE OPTO, 2022, San Francisco, California, United States
Abstract
Optical interposers are promising as a robust, reliable, and scalable technology for high-density coupling between the dissimilar platforms of optical fiber and silicon photonics (SiP) chips. To extend this concept, femtosecond laser micro-structuring was harnessed to develop a multi-level, mirror-waveguide optical circuit platform in fused silica glass. The flexible laser writing facilitated compact, low-profile vertical interconnection between multi-core fibers and SiP circuits, exploiting total internal reflection mirrors and vertical grating couplers. Various design strategies of laying out 3D waveguide fanouts, multi-core fiber sockets, and turn-mirrors were explored in 40 channel systems. The flexible interposer technology is scalable to higher channel counts, while maintaining a small footprint, thus offering a broad solution to challenges in areas of optical interconnects and photonic packaging.
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Gligor Djogo, Amir Rahimnouri, Jianzhao Li, Stephen Ho, and Peter R. Herman "Fiber-to-silicon photonics interposer for high-density vertical coupling through laser structured mirror-waveguide circuits", Proc. SPIE PC12007, Optical Interconnects XXII, PC120070H (5 March 2022); https://doi.org/10.1117/12.2609088
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KEYWORDS
Photonics
Waveguides
Structured optical fibers
Optical fibers
Chemical elements
Femtosecond phenomena
Glasses
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