DDR process and materials for novel tone reverse technique

Shuhei Shigaki; Wataru Shibayama; Satoshi Takeda; Mamoru Tamura; Makoto Nakajima; Rikimaru Sakamoto

doi:10.1117/12.2297517

19 March 2018 DDR process and materials for novel tone reverse technique

Shuhei Shigaki, Wataru Shibayama, Satoshi Takeda, Mamoru Tamura, Makoto Nakajima, Rikimaru Sakamoto

Proceedings Volume 10583, Extreme Ultraviolet (EUV) Lithography IX; 105830M (2018) https://doi.org/10.1117/12.2297517
Event: SPIE Advanced Lithography, 2018, San Jose, California, United States

Abstract

We developed the novel process and material which can be created reverse-tone pattern without any collapse. The process was Dry Development Rinse (DDR) process, and the material used in this process was DDR material. DDR material was containing siloxane polymer which could be replaced the space area of the photo resist pattern. And finally, the reverse-tone pattern could be obtained by dry etching process without any pattern collapse issue.

DDR process could be achieved fine line and space patterning below hp14nm without any pattern collapse by combination of PTD or NTD photo resist.

DDR materials were demonstrated with latest coater track at imec. DDR process was fully automated and good CD uniformity was achieved after dry development. Detailed evaluation could be achieved with whole wafer such a study of CD uniformity (CDU). CDU of DDR pattern was compared to pre-pattern’s CDU. Lower CDU was achieved and CDU healing was observed with special DDR material. By further evaluation, special DDR material showed relatively small E-slope compared to another DDR material. This small E-slope caused CDU improvement.

Conference Presentation

Citation Download Citation

Shuhei Shigaki, Wataru Shibayama, Satoshi Takeda, Mamoru Tamura, Makoto Nakajima, and Rikimaru Sakamoto "DDR process and materials for novel tone reverse technique", Proc. SPIE 10583, Extreme Ultraviolet (EUV) Lithography IX, 105830M (19 March 2018); https://doi.org/10.1117/12.2297517

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