Paper
10 August 2000 Failure analysis of tungsten-coated polysilicon micromachined microengines
Jeremy A. Walraven, Seethambal S. Mani, James G. Fleming, Thomas J. Headley, Paul G. Kotula, Alejandro A. Pimentel, Michael J. Rye, Danelle M. Tanner, Norman F. Smith
Author Affiliations +
Proceedings Volume 4180, MEMS Reliability for Critical Applications; (2000) https://doi.org/10.1117/12.395708
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States
Abstract
Failure analysis (FA) tools have been applied to analyze tungsten coated polysilicon microengines. These devices were stressed under accelerated conditions at ambient temperatures and pressure. Preliminary results illustrating the failure modes of microengines operated under variable humidity and ultra-high drive frequency will also be shown. Analysis os tungsten coated microengines revealed the absence of wear debris in microengines operated under ambient conditions. Plan view imagine of these microengines using scanning electron microscopy (SEM) revealed no accumulation of wear debris on the surface of the gears or ground plane on microengines operated under standard laboratory conditions. Friction bearing surfaces were exposed and analyzed using the focused ion beam (FIB). These cross sections revealed no accumulation of debris along friction bear surfaces. By using transmission electro microscopy (TEM) in conjunction with electron energy loss spectroscopy (EELS), we were able to identify the thickness, elemental analysis, and crystallographic properties of tungsten coated MEMS devices. Atomic force microscopy was also utilized to analyze the surface roughness of friction bearing surfaces.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jeremy A. Walraven, Seethambal S. Mani, James G. Fleming, Thomas J. Headley, Paul G. Kotula, Alejandro A. Pimentel, Michael J. Rye, Danelle M. Tanner, and Norman F. Smith "Failure analysis of tungsten-coated polysilicon micromachined microengines", Proc. SPIE 4180, MEMS Reliability for Critical Applications, (10 August 2000); https://doi.org/10.1117/12.395708
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Cited by 20 scholarly publications.
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KEYWORDS
Tungsten

Microelectromechanical systems

Scanning electron microscopy

Transmission electron microscopy

Failure analysis

Electrical breakdown

Silicon

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